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Power chips are linked to outside circuits with product packaging, and their efficiency relies on the support of the packaging. In high-power scenarios, power chips are typically packaged as power components. Chip affiliation describes the electrical connection on the top surface area of the chip, which is usually aluminum bonding wire in typical components. ^ Traditional power module bundle cross-section

Presently, business silicon carbide power components still mostly utilize the product packaging technology of this wire-bonded typical silicon IGBT module. They deal with problems such as large high-frequency parasitical criteria, insufficient warm dissipation capacity, low-temperature resistance, and inadequate insulation strength, which restrict the use of silicon carbide semiconductors. The display screen of exceptional performance. In order to address these problems and totally exploit the huge possible benefits of silicon carbide chips, numerous brand-new product packaging technologies and options for silicon carbide power components have actually arised in recent times.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have established from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold cables to copper wires, and the driving pressure is expense reduction; high-power tools have actually developed from light weight aluminum cords (strips) to Cu Clips, and the driving force is to boost item efficiency. The greater the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared to traditional bonding product packaging techniques, Cu Clip innovation has the complying with advantages:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a certain degree, changes the standard cable bonding method between the chip and the pins. Therefore, a special package resistance worth, higher present circulation, and far better thermal conductivity can be gotten.

2. The lead pin welding area does not need to be silver-plated, which can fully conserve the price of silver plating and bad silver plating.

3. The item appearance is entirely consistent with regular items and is generally used in servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and other fields.

Cu Clip has two bonding techniques.

All copper sheet bonding approach

Both the Gate pad and the Resource pad are clip-based. This bonding technique is extra expensive and intricate, yet it can achieve better Rdson and far better thermal results.

( copper strip)

Copper sheet plus cable bonding technique

The resource pad makes use of a Clip method, and the Gate utilizes a Cord method. This bonding technique is a little less expensive than the all-copper bonding technique, conserving wafer area (appropriate to very tiny gateway locations). The procedure is simpler than the all-copper bonding method and can obtain better Rdson and much better thermal result.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding cu2o, please feel free to contact us and send an inquiry.